IIB 2024
Registration
  • Home
    • Previous editions
  • Committees
  • Program
    • Detailed schedule
    • Plenary speakers
    • Call for papers
    • Instructions to authors
    • Submission and registration form
    • Publication
  • Sponsors
  • Information
    • Deadlines & fees
    • Your venue
    • Profile page
  • Contacts
  • Home
    • Previous editions
  • Committees
  • Program
    • Detailed schedule
    • Plenary speakers
    • Call for papers
    • Instructions to authors
    • Submission and registration form
    • Publication
  • Sponsors
  • Information
    • Deadlines & fees
    • Your venue
    • Profile page
  • Contacts

Submission and registration form

To prepare your submision, you can use this template. Please select the A4 format (not Letter format) and do not exceed one page length. The book of abstract will be available in digital version (downloadable from the web site and given on the USB-key) but some issues will be printed in black-and-white only. So take care with the pictures/schemas and their contrast. Please note that the extended deadline of submission for oral or poster presentation is February 29th, 2024.

IMPORTANT – Participants from the mainland of China: after filling the registration form, please contact Professor Xinfu Gu via Wechat (ID: guxinfu-cn) for the details about the advanced payment of registration fees. All other participants can regularize and pay their fee online by credit card (Visa, Mastercard, American Express) or by wire transfer.

If you already submitted a contribution, you don’t need to fill in a new form but just log on your profile page.

Contact

For any request, please contact:

+33 (0)2 47 27 33 30

secretary@iib2024.org
Important Dates

Extended deadline for submission abstract:
February 29th, 2024

Notification of acceptance:
March 15th, 2024

Early bird fee deadline:
May 15th, 2024

 

Organizers

Tsinghua University;
Beijing University of Technology;
Taiyuan University of Technology.

Supporting Organizations

Committee on Defects in Solids, Chinese Physics Society;
Committee on Electron Microscopy and Committee on Ceramics, Chinese Crystallography Society.

Propulsed by VERT COM agency