IIB 2024
Registration
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    • Previous editions
  • Committees
  • Program
    • Detailed schedule
    • Plenary speakers
    • Call for papers
    • Instructions to authors
    • Submission and registration form
    • Publication
  • Sponsors
  • Information
    • Deadlines & fees
    • Your venue
    • Profile page
  • Contacts
  • Home
    • Previous editions
  • Committees
  • Program
    • Detailed schedule
    • Plenary speakers
    • Call for papers
    • Instructions to authors
    • Submission and registration form
    • Publication
  • Sponsors
  • Information
    • Deadlines & fees
    • Your venue
    • Profile page
  • Contacts

ANNOUNCEMENT

It is our pleasure to make the second announcement for the 17th International Conference on Intergranular and Interphase Boundaries in Materials (IIB 2024), to be held in Beijing, China, at the Beijing International Conference Center from July 8-12, 2024.

Please notice that the date has shifted one week later than that previously planned, to avoid time conflict with other important conferences.

Since the COVID-19 pandemic is over, there will be clean and free air all over the world by the time of the meeting in 2024. We look forward to seeing you in Beijing, China.

GOAL AND AUDIENCE

The important role of interfaces in determining the properties of materials, and in microstructural evolution during manufacture and in-service operation, is increasingly appreciated by a wide range of researchers in different fields as a consequence of advances in theory, instrumentation, software and computational resources allowing investigation of interfaces at the atomic scale.

IIB conferences provide a platform for scientists and researchers to exchange ideas regarding the understanding, control, and design of interfaces in various materials and to share new advances in their research in different fields of interface science and technologies.

COVERAGE

IIB conferences strongly promote an interdisciplinary approach in the field of structures and properties of grain boundaries and interphase boundaries in a wide range of materials. A variety of hot topics will include but not limited to:

  • Characterization of interfaces
  • Modeling of interfaces
  • Thermodynamics and kinetics of interfaces
  • Properties of interfaces
  • Interfaces in metals, ceramics, composites, and organic materials
  • Interfaces in electronic, magnetic, and energy materials
  • Interfaces in biomaterials, nanomaterials, and emerging materials

Join the IIB 2024 conference!

Download the final circular with practical information.

Final circular

Our invited speakers

Speakers 2022

Qian Yu

(Zhejiang University)

Speakers 2022

Jian Luo

(University of California, San Diego)

Speakers 2022

Wayne D. Kaplan

(Israel Institute of Technology)

Speakers 2022

Yuichi Ikuhara

(University of Tokyo)

Speakers 2022

Gerhard Dehm

(Max-Planck-Institut für Eisenforschun)

Speakers 2022

Klaus van Benthem

(University of California, Davis)

Contact

For any request, please contact:

+33 (0)2 47 27 33 30

secretary@iib2024.org
Important Dates

Extended deadline for submission abstract:
February 29th, 2024

Notification of acceptance:
March 15th, 2024

Early bird fee deadline:
May 15th, 2024

 

Organizers

Tsinghua University;
Beijing University of Technology;
Taiyuan University of Technology.

Supporting Organizations

Committee on Defects in Solids, Chinese Physics Society;
Committee on Electron Microscopy and Committee on Ceramics, Chinese Crystallography Society.

Propulsed by VERT COM agency