IIB 2024
Submission / Registration
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  • Home
    • Previous editions
  • Committees
  • Program
    • Invited speakers
    • Call for papers
    • Submission form
    • Profile page
    • Publication
  • Deadlines & fees
  • Sponsors
  • Contacts

Call for papers

The submission form is now open.

 

IIB2024 welcomes papers covering various intergranular and interphase boundaries in materials. IIB 2024 will be a one-session conference based on invited lectures, oral presentations, extended discussion periods, and poster sessions (posters will be exposed during entire duration of the conference).

Abstracts and presentations are in English. When you prepare an abstract to IIB2024, please use the provided template. Please use full first name and last name of all author, and underline the name of the presenting author. To avoid possible format change, it is suggested to submit your abstract in PDF form. Please indicate with the keywords on the materials, main methods, e.g., electron microscopy or simulation, so that Conference Secretariat can send your abstract to an appropriate reviewer.

Important dates:

Deadline for submission abstract: January 31st, 2024

Notification of acceptance: February 28th, 2024

Coverage:

A variety of hot topics will include but not limited to:

  • Characterization of interfaces
  • Modeling of interfaces
  • Thermodynamics and kinetics of interfaces
  • Properties of interfaces
  • Interfaces in metals, ceramics, composites, and organic materials
  • Interfaces in electronic, magnetic, and energy materials
  • Interfaces in biomaterials, nanomaterials, and emerging materials

The program will be revealed after the submission process.

Contact

For any request, please contact:

+33 (0)2 47 27 33 30

secretary@iib2024.org
Important Dates

Deadline for submission abstract:
January 31st, 2024

Notification of acceptance:
February 28th, 2024

 

Sponsors

For those who are interested to become sponsors, please contact Professor Gong (gong@tsinghua.edu.cn).

Propulsed by VERT COM agency